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| BUZ 355 SIPMOS (R) Power Transistor * N channel * Enhancement mode * Avalanche-rated Pin 1 G Pin 2 D Pin 3 S Type BUZ 355 VDS 800 V ID 6A RDS(on) 1.5 Package TO-218 AA Ordering Code C67078-S3107-A2 Maximum Ratings Parameter Continuous drain current Symbol Values 6 Unit A ID IDpuls 24 TC = 29 C Pulsed drain current TC = 25 C Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Avalanche energy, single pulse IAR EAR EAS 5.1 15 mJ ID = 6 A, VDD = 50 V, RGS = 25 L = 37.5 mH, Tj = 25 C Gate source voltage Power dissipation 720 VGS Ptot 20 125 V W TC = 25 C Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Semiconductor Group Tj Tstg RthJC RthJA -55 ... + 150 -55 ... + 150 1 75 E 55 / 150 / 56 C K/W 1 07/96 BUZ 355 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 800 3 10 10 0.9 4 V VGS = 0 V, ID = 0.25 mA, Tj = 25 C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS 1 100 A VDS = 800 V, VGS = 0 V, Tj = 25 C VDS = 800 V, VGS = 0 V, Tj = 125 C Gate-source leakage current IGSS 100 nA 1.5 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS = 10 V, ID = 3.9 A Semiconductor Group 2 07/96 BUZ 355 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 2.5 6.8 1750 190 100 - S pF 2350 290 150 ns 25 40 VDS 2 * ID * RDS(on)max, ID = 3.9 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 10 V, ID = 2.1 A RGS = 50 Rise time tr 130 200 VDD = 30 V, VGS = 10 V, ID = 2.1 A RGS = 50 Turn-off delay time td(off) 400 530 VDD = 30 V, VGS = 10 V, ID = 2.1 A RGS = 50 Fall time tf 130 175 VDD = 30 V, VGS = 10 V, ID = 2.1 A RGS = 50 Semiconductor Group 3 07/96 BUZ 355 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TC = 25 C Inverse diode direct current,pulsed A 0.95 0.3 2.5 4 16 V 1.4 s C Values typ. max. Unit ISM VSD trr Qrr TC = 25 C Inverse diode forward voltage VGS = 0 V, IF = 12 A Reverse recovery time VR = 100 V, IF=lS, diF/dt = 100 A/s Reverse recovery charge VR = 100 V, IF=lS, diF/dt = 100 A/s Semiconductor Group 4 07/96 BUZ 355 Power dissipation Ptot = (TC) Drain current ID = (TC) parameter: VGS 10 V 6.5 A 5.5 130 W 110 Ptot 100 90 80 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 C 160 ID 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 20 40 60 80 100 120 C 160 TC TC Safe operating area ID = (VDS) parameter: D = 0.01, TC = 25C 10 2 Transient thermal impedance Zth JC = (tp) parameter: D = tp / T 10 1 K/W A t = 23.0s p ID 10 1 D ZthJC 100 s 10 0 /I =V DS 10 -1 1 ms D = 0.50 0.20 0.10 10 0 R DS (on ) 10 ms 10 -2 0.05 0.02 0.01 DC 10 -1 single pulse 3 10 0 10 1 10 2 10 -3 V 10 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 s 10 0 VDS tp Semiconductor Group 5 07/96 BUZ 355 Typ. output characteristics ID = (VDS) parameter: tp = 80 s 14 A 12 Typ. drain-source on-resistance RDS (on) = (ID) parameter: VGS 5.0 Ptot = 125W l k i j hg f e VGS [V] a 4.0 b 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0 RDS (on) 4.0 3.5 3.0 2.5 2.0 a b c ID 11 10 9 8 7 6 5 4 3 c c dd e f g h i j k l d 1.5 f e h j k g i b 1.0 0.5 VGS [V] = a 4.5 4.0 b 5.0 c 5.5 d 6.0 e f 6.5 7.0 g 7.5 2 1 0 0 a h i j k 8.0 9.0 10.0 20.0 0.0 4 8 12 16 20 24 28 32 V 38 0 1 2 3 4 5 6 7 8 A 10 VDS ID Typ. transfer characteristics ID = f (VGS) Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s VDS2 x ID x RDS(on)max 16 parameter: tp = 80 s, VDS2 x ID x RDS(on)max 10 S A ID 12 gfs 8 7 10 6 5 4 3 8 6 4 2 2 0 0 1 0 1 2 3 4 5 6 7 8 V 10 0 2 4 6 8 VGS A ID 12 Semiconductor Group 6 07/96 BUZ 355 Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 3.9 A, VGS = 10 V 6.0 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 1 mA 4.6 V 4.0 5.0 98% RDS (on) VGS(th) 3.6 3.2 4.5 typ 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -60 -20 20 60 100 C 160 2.8 2.4 2.0 2% 98% 1.6 1.2 0.8 0.4 0.0 -60 -20 20 60 100 C 160 typ Tj Tj Typ. capacitances C = f (VDS) parameter:VGS = 0V, f = 1MHz 10 4 Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s 10 2 pF C A Ciss 10 3 IF 10 1 Coss 10 2 10 0 Crss Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%) 10 1 0 5 10 15 20 25 30 V VDS 40 10 -1 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 07/96 BUZ 355 Avalanche energy EAS = (Tj ) parameter: ID = 6 A, VDD = 50 V RGS = 25 , L = 37.5 mH 750 mJ 650 Typ. gate charge VGS = (QGate) parameter: ID puls = 9 A 16 V EAS 600 550 500 450 400 350 300 250 200 150 100 50 0 20 VGS 12 10 0,2 VDS max 8 0,8 VDS max 6 4 2 0 40 60 80 100 120 C 160 0 20 40 60 80 100 120 140 160 nC 190 Tj Q Gate Drain-source breakdown voltage V(BR)DSS = (Tj ) 960 V 920 V(BR)DSS 900 880 860 840 820 800 780 760 740 720 -60 -20 20 60 100 C 160 Tj Semiconductor Group 8 07/96 BUZ 355 Package Outlines TO-218 AA Dimension in mm Semiconductor Group 9 07/96 |
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